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1

Optimized ultra-thin manganin alloy passivated fine-pitch damascene compatible bump-less Cu–Cu bonding at sub 200 °C for three-dimensional Integration applications

Panigrahi, Asisa Kumar, Kumar, C. Hemanth, Bonam, Satish, Ghosh, Tamal, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Journal:

Japanese Journal of Applied Physics

Year:

2018

Language:

english

File:

PDF, 2.04 MB

english, 2018

2

[IEEE 2016 2nd International Conference on Next Generation Computing Technologies (NGCT) - Dehradun, India (2016.10.14-2016.10.16)] 2016 2nd International Conference on Next Generation Computing Technologies (NGCT) - A novel image encryption algorithm using AES and visual cryptography

Kalubandi, Venkata Krishna Pavan, Vaddi, Hemanth, Ramineni, Vishnu, Loganathan, Agilandeeswari

Year:

2016

Language:

english

File:

PDF, 339 KB

english, 2016

3

Receptor-Specific Delivery of Peptide Nucleic Acids Conjugated to Three Sequentially Linked N-Acetyl Galactosamine Moieties into Hepatocytes

Ganesh, Krishna N., Bhingardeve, Pramod, Madhanagopal, Bharath Raj, jain, prashant, Naick, Hemanth, Manoharan, Muthiah

Journal:

Journal of Organic Chemistry

Year:

2020

File:

PDF, 1.21 MB

2020

4

Recycling fish skin for utilization in food industry as an effective emulsifier and foam stabilizing agent

Kumar, Krishna Kant, Singh, Saurabh, Chakraborthy, Sanchari, Das, Jayashree, Bajaj, Mayur, Hemanth, Varnika, Nair, Meghna, Thota, Leelakrishna, Banerjee, Pradipta

Journal:

Turkish Journal of Biochemistry

Year:

2018

File:

PDF, 1.74 MB

2018

5

Evaluation of biotinylated magnetic nanoparticles for tumour imaging

Chauhan, Ram Prakash, Mathur, Rashi, Singh, Gurjaspreet, Bag, Narmada, Singh, Sweta, Chuttani, Krishna, Kumar, B. S. Hemanth, Agrawal, Satyam K., Mishra, Anil K.

Journal:

Journal of Materials Science

Year:

2013

Language:

english

File:

PDF, 1.17 MB

english, 2013

6

[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Optimized ultra-thin Manganin alloy passivated fine-pitch damascene compatible Cu-Cu bonding at sub 200°C for 3D IC integration

Panigrahi, Asisa Kumar, Kumar, C. Hemanth, Ghosh, Tamal, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Year:

2017

Language:

english

File:

PDF, 326 KB

english, 2017

7

T2071 Intraepithelial Cd3 and CD4 Cells as Unique Surrogate Markers for Mucosal Immunity in Irritable Bowel Syndrome

Basu, P. Patrick, Shah, Niraj James, Krishnaswamy, Nithya, Hampole, Hemanth N., Narayanankutty, Naveen, Pacana, Tommy, Rayapudi, Krishna

Journal:

Gastroenterology

Year:

2010

Language:

english

File:

PDF, 132 KB

english, 2010

8

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Gold Passivated Cu-Cu Bonding At 140°C For 3D IC Packaging And Heterogeneous Integration Applications.

Bonam, Satish, Kumar, C Hemanth, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Year:

2018

Language:

english

File:

PDF, 348 KB

english, 2018

9

Life Cycle Assessment of Filtration Systems of Reverse Osmosis Units: A Case Study of a University Campus

Bhakar, Vikrant, Kumar, D.N.S. Hemanth, Sai, Nitin Krishna, Sangwan, Kuldip Singh, Raghuvanshi, Smita

Journal:

Year:

2016

Language:

english

File:

PDF, 278 KB

english, 2016

10

[IEEE 2018 IEEE CPMT Symposium Japan (ICSJ) - Kyoto, Japan (2018.11.19-2018.11.21)] 2018 IEEE CPMT Symposium Japan (ICSJ) - Silicide based integration approach for fabricating highly reliable, hermitically sealed on-chip, low form factor-microfluidics for 3D IC cooling applications

Kumar, C. Hemanth, Bonam, Satish, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Year:

2018

File:

PDF, 123 KB

2018

11

Role of deep convection on the tropical tropopause characteristics at sub-daily scales over the South India monsoon region

Hemanth Kumar, A., Venkat Ratnam, M., Sunilkumar, S.V., Parameswaran, K., Krishna Murthy, B.V.

Journal:

Atmospheric Research

Year:

2015

Language:

english

File:

PDF, 2.53 MB

english, 2015

12

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Achieving of Intensified Conductive Interconnections for Flex-on-Flex by Using Metal Passivated Copper – Copper Thermocompression Bonding

Cheemalamarri, Hemanth Kumar, panigrahi, Asisa Kumar, Bonam, Satish, Paul, Nirupam, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Year:

2018

Language:

english

File:

PDF, 555 KB

english, 2018

13

[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Interface Analysis of High Reliable Hermitic Sealed Microfluidic Channels for Thermal Cooling in 3D ICs

Cheemalamarri, Hemanth Kumar, Bonam, Satish, Banik, Dhiman, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Year:

2019

Language:

english

File:

PDF, 3.28 MB

english, 2019

14

[IEEE 2013 IEEE 9th International Conference on Wireless and Mobile Computing, Networking and Communications (WiMob) - Lyon, France (2013.10.7-2013.10.9)] 2013 IEEE 9th International Conference on Wireless and Mobile Computing, Networking and Communications (WiMob) - Enhanced distributed resource allocation and interference management in LTE femtocell networks

Sathya, Vanlin, Gudivada, Harsha Vardhan, Narayanam, Hemanth, Krishna, Bala Murali, Tamma, Bheemarjuna Reddy

Year:

2013

Language:

english

File:

PDF, 1015 KB

english, 2013

15

M1270 Transdermal Rivastigmine for Treatment of Encephalopathy in Liver Cirrhosis, a Randomized Placebo Controlled Trial (T R E C Trial)

Basu, P. Patrick, Shah, Niraj James, Krishnaswamy, Nithya, Hampole, Hemanth N., Pacana, Tommy, Rayapudi, Krishna, Brown, Robert S.

Journal:

Gastroenterology

Year:

2010

Language:

english

File:

PDF, 89 KB

english, 2010

16

Interface and reliability analysis of Au passivated Cu-Cu fine pitch thermocompression bonding for 3D IC applications

Bonam, Satish, Panigrahi, Asisa Kumar, Kumar, C Hemanth, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2019

Language:

english

File:

PDF, 1.12 MB

english, 2019

17

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Metal-Alloy Cu Surface Passivation Leads to High Quality Fine-Pitch Bump-Less Cu-Cu Bonding for 3D IC and Heterogeneous Integration Applications

Panigrahi, Asisa Kumar, C, Hemanth Kumar, Bonam, Satish, K, Brince Paul, Ghosh, Tamal, Paul, Nirupam, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Year:

2018

Language:

english

File:

PDF, 436 KB

english, 2018

18

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - High Density metal alloy Interconnections Using Novel Wafer Bonding Approach For 3D IC Packaging Applications

Kumar, C Hemanth, Bonam, Satish, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Year:

2018

Language:

english

File:

PDF, 331 KB

english, 2018

19

Design and analysis of stepped reconfigurable rectangular patch antenna for LTE, vehicular and ultra wideband applications

Ajay Babu, M, T P Madhav, B, Bhargavi, G, Sai Krishna, V, Hemanth Kumar Reddy, Y, V.S. Kalyan, G, Venkateswara Rao, M

Journal:

International Journal of Engineering and Technology

Year:

2017

File:

PDF, 708 KB

2017

20

Fault Diagnosis of Welded Joints through Vibration Signals Using Naïve Bayes Algorithm

Kumar, M. Girish, Hemanth, K., Gangadhar, N., Kumar, Hemantha, Krishna, Prasad

Journal:

Procedia Materials Science

Year:

2014

File:

PDF, 1.17 MB

2014

21

PK-11195: A POTENTIAL DRUG IN LEUKEMIA TREATMENT

Krishna, G Mohana, Kumar, M Hemanth, Kiran, M Asha

Journal:

International Research Journal of Pharmacy

Year:

2014

Language:

english

File:

PDF, 2.47 MB

english, 2014

22

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Achieving of Intensified Conductive Interconnections for Flex-on-Flex by Using Metal Passivated Copper – Copper Thermocompression Bonding

Cheemalamarri, Hemanth Kumar, panigrahi, Asisa Kumar, Bonam, Satish, Paul, Nirupam, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Year:

2018

File:

PDF, 555 KB

2018

23

Cross tropopause flux observed at sub-daily scales over the south Indian monsoon regions

Hemanth Kumar, A., Venkat Ratnam, M., Sunilkumar, S.V., Parameswaran, K., Krishna Murthy, B.V.

Journal:

Atmospheric Research

Year:

2017

Language:

english

File:

PDF, 1021 KB

english, 2017

24

Eco-friendly lightweight filament synthesis and mechanical characterization of additively manufactured closed cell foams

Patil, Balu, Bharath Kumar, B.R., Bontha, Srikanth, Balla, Vamsi Krishna, Powar, Satvasheel, Hemanth Kumar, V., Suresha, S.N., Doddamani, Mrityunjay

Journal:

Composites Science and Technology

Year:

2019

Language:

english

File:

PDF, 5.14 MB

english, 2019

25

Dynamic imaging of the craniovertebral junction is mandatory in patients with posterior circulation strokes

Vupputuri, Hemanth, Gandham, Edmond Jonathan, Mani, Sunithi Alexandar, Raju, Krishna Prabhu, Aaron, Sanjith, Chacko, Ari George

Journal:

European Spine Journal

Year:

2020

Language:

english

File:

PDF, 1.50 MB

english, 2020

26

Tropical tropopause dynamics (TTD) campaigns over Indian region: An overview

Venkat Ratnam, M., Sunilkumar, S.V., Parameswaran, K., Krishna Murthy, B.V., Ramkumar, Geetha, Rajeev, K., Basha, Ghouse, Ravindra Babu, S., Muhsin, M., Kumar Mishra, Manoj, Hemanth Kumar, A., Akhil R

Journal:

Journal of Atmospheric and Solar-Terrestrial Physics

Year:

2014

Language:

english

File:

PDF, 7.17 MB

english, 2014

27

Ti/Si interface enabling CMOS compatible, high reliable bonding for inter-die micro-fluidic cooling for future advanced 3D IC integration

Cheemalamarri, Hemanth Kumar, Bonam, Satish, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Journal:

Journal of Micromechanics and Microengineering

Year:

2020

File:

PDF, 1.84 MB

2020

28

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Metal-Alloy Cu Surface Passivation Leads to High Quality Fine-Pitch Bump-Less Cu-Cu Bonding for 3D IC and Heterogeneous Integration Applications

Panigrahi, Asisa Kumar, C, Hemanth Kumar, Bonam, Satish, K, Brince Paul, Ghosh, Tamal, Paul, Nirupam, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Year:

2018

File:

PDF, 436 KB

2018

29

Design, synthesis and biological evaluation of theophylline containing variant acetylene derivatives as α-amylase inhibitors

Raju. Ruddarraju, Radhakrishnam, Kiran, Gangarapu., Chari. Murugulla, Adharvana, Maroju, Ravichandar., Krishna Prasad, Devarakonda, Hemanth Kumar, Boyina, Shravya Reddy, Nukala

Journal:

Bioorganic Chemistry

Year:

2019

Language:

english

File:

PDF, 4.61 MB

english, 2019

30

Direct, CMOS In-Line Process Flow Compatible, Sub 100 °C Cu–Cu Thermocompression Bonding Using Stress Engineering

Panigrahi, Asisa Kumar, Ghosh, Tamal, Kumar, C. Hemanth, Singh, Shiv Govind, Vanjari, Siva Rama Krishna

Journal:

Electronic Materials Letters

Year:

2018

Language:

english

File:

PDF, 1.43 MB

english, 2018

31

Single dose oral toxicity study of Picrorhiza kurroa rhizome extract in Wistar rats

Krishna, Acharya Bal, Manikyam, Hemanth Kumar, Sharma, Vinay K, Sharma, Niti

Journal:

Fundamental Toxicological Sciences

Year:

2016

Language:

english

File:

PDF, 227 KB

english, 2016

32

S2032 Assessment of Tissue Tumor Necrosis Factor Alfa as a Novel Marker for Latent Celiac Disease

Basu, P. Patrick, Shah, Niraj James, Hampole, Hemanth N., Krishnaswamy, Nithya, Pacana, Tommy, Rayapudi, Krishna

Journal:

Gastroenterology

Year:

2010

Language:

english

File:

PDF, 87 KB

english, 2010

33

Metal Based Imaging Probes of DO3A-Act-Met for LAT1 Mediated Methionine Specific Tumors : Synthesis and Preclinical Evaluation

Kadiyala, K Ganesh, Datta, Anupama, Tanwar, Jyoti, Adhikari, Anupriya, Kumar, B. S. Hemanth, Chuttani, Krishna, Thirumal, Meganathan, Mishra, Anil K.

Journal:

Pharmaceutical Research

Year:

2015

Language:

english

File:

PDF, 922 KB

english, 2015

34

Optimization of Magneto-Rheological Damper for Maximizing Magnetic Flux Density in the Fluid Flow Gap Through FEA and GA Approaches

Krishna, Hemanth, Kumar, Hemantha, Gangadharan, Kalluvalappil

Journal:

Journal of The Institution of Engineers (India): Series C

Year:

2017

Language:

english

File:

PDF, 1.03 MB

english, 2017

35

[IEEE 2018 IEEE International Interconnect Technology Conference (IITC) - Santa Clara, CA, USA (2018.6.4-2018.6.7)] 2018 IEEE International Interconnect Technology Conference (IITC) - Silicide Based Low Temperature and Low Pressure Bonding of TI/SI for Microfludic and Hermetic Selaling Application

Kumar, C Hemanth, Pnaigrahi, Asisa Kumar, Paul, Nirupam, Bonam, Satish, Krishna Vanjari, Siva Rama, Singh, Shiv Govind, Panigrahi, Asisa Kumar

Year:

2018

Language:

english

File:

PDF, 2.14 MB

english, 2018

36

[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Achieving of aluminumâaluminum wafer bonding at low temperature and pressure using Surface passivated technique

Bonam, Satish, Kumar, C Hemanth, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Year:

2019

Language:

english

File:

PDF, 4.64 MB

english, 2019

37

Smart home system based on IoT

Pavan Kumar, T, Hemanth krishna, R, Sai krishna, M, Meghana, Jhanavi

Journal:

International Journal of Engineering and Technology

Year:

2018

Language:

english

File:

PDF, 281 KB

english, 2018

38

[IEEE 2015 IEEE Recent Advances in Intelligent Computational Systems (RAICS) - Trivandrum, Kerala, India (2015.12.10-2015.12.12)] 2015 IEEE Recent Advances in Intelligent Computational Systems (RAICS) - VSI asissted voltage control of a novel Bifurcated Winding Induction Generator

Kumar, D Hemanth, Kanth, Krishna, Pujar, Adithya, Ananth, B N, Meena, P.

Year:

2015

Language:

english

File:

PDF, 2.27 MB

english, 2015

39

Securing Multi-cloud Using Secret Sharing Algorithm

Muhil, M., Krishna, U. Hemanth, Kumar, R. Kishore, Anita, E.A. Mary

Journal:

Procedia Computer Science

Year:

2015

Language:

english

File:

PDF, 664 KB

english, 2015

40

Anxiolytic actions of Nardostachys jatamansi via GABA benzodiazepine channel complex mechanism and its biodistribution studies

Razack, Sakina, Kandikattu, Hemanth Kumar, Venuprasad, M. P., Amruta, Narayanappa, Khanum, Farhath, Chuttani, Krishna, Mishra, Anil Kumar

Journal:

Metabolic Brain Disease

Year:

2018

Language:

english

File:

PDF, 1.46 MB

english, 2018

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